BERGQUIST LIQUI FORM TLF 4500CGEL SF
Products & Services
Information
4.5 W/mK , 1 component, cure in place liquid thermal interface material based on silicone free chemistry.
Key benefits:
» Low assembly stress eliminating component damage & failure during assembly
» Excellent vertical gap stability for long term reliability & performance
» Exhibits no cracking/low voiding in cure condition
» Low dispensing viscosity & high thixotropy
» Ease of dispensing with high shot consistency for high throughput manufacturing
» Excellent wet out for lower thermal impedance
Discover our customer's success story: https://www.henkel-adhesives.com/us/en/insights/all-insights/success-stories/TLF-4500-C-GEL-SF.html